·Ultra-small and Low profile 1.2x1.0x0.3 mm Max.
·Reflow compatible
·Ceramic package with High reliability
Applications:
·Mobile Communications ,(?)Bluetooth,(?)Wireless LAN
·Ultra-small and Low profile 1.6x1.2x0.35mm Max.
·Reflow compatible
·Ceramic package with High reliability
Applications:
·Mobile Communications ,(?)Bluetooth,(?)Wireless LAN
·Ultra-small and Low profile 2.0x1.6x0.45mm Max.
·Reflow compatible
·Ceramic package with High reliability
Applications:
·Mobile Communications ,(?)Bluetooth,(?)Wireless LAN
Features :
·Small and Low profile 2.5x2.0x0.6mm Max.
·Reflow compatible
·Ceramic package with High reliability
Applications:
·Digital Electronics & Industrial field
·Consumer products
Features :
·Small and Low profile 3.2x2.5x0.7mm Max.
·Reflow compatible
·Ceramic package with High reliability
Applications:
·Digital Electronics & Industrial field
·Consumer products